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多再入工况下一体化热防护系统拓扑优化设计

邓通相 匡格平 胡兆财 唐光武 杨强 高博

邓通相, 匡格平, 胡兆财, 唐光武, 杨强, 高博. 多再入工况下一体化热防护系统拓扑优化设计[J]. 应用数学和力学, 2023, 44(11): 1299-1310. doi: 10.21656/1000-0887.440163
引用本文: 邓通相, 匡格平, 胡兆财, 唐光武, 杨强, 高博. 多再入工况下一体化热防护系统拓扑优化设计[J]. 应用数学和力学, 2023, 44(11): 1299-1310. doi: 10.21656/1000-0887.440163
DENG Tongxiang, KUANG Geping, HU Zhaocai, TANG Guangwu, YANG Qiang, GAO Bo. Topology Optimizations of Integrated Thermal Protection Systems in Multiple Reentry Load Cases[J]. Applied Mathematics and Mechanics, 2023, 44(11): 1299-1310. doi: 10.21656/1000-0887.440163
Citation: DENG Tongxiang, KUANG Geping, HU Zhaocai, TANG Guangwu, YANG Qiang, GAO Bo. Topology Optimizations of Integrated Thermal Protection Systems in Multiple Reentry Load Cases[J]. Applied Mathematics and Mechanics, 2023, 44(11): 1299-1310. doi: 10.21656/1000-0887.440163

多再入工况下一体化热防护系统拓扑优化设计

doi: 10.21656/1000-0887.440163
基金项目: 

国家自然科学基金项目 11672088

国家自然科学基金项目 11472092

国家自然科学基金项目 11502058

国家自然科学基金项目 12090034

中国科协青年人才托举工程 2021QNRC001

详细信息
    作者简介:

    邓通相(1998—),男,硕士(E-mail: 21s018013@stu.hit.edu.cn)

    通讯作者:

    高博(1992—),男,助理教授,博士(通讯作者. E-mail: 18b918033@stu.hit.edu.cn)

  • (我刊编委唐光武来稿)
  • 中图分类号: O34;V45

Topology Optimizations of Integrated Thermal Protection Systems in Multiple Reentry Load Cases

  • (Contributed by TANG Guangwu, M. AMM Editorial Board)
  • 摘要: 一体化热防护系统(integrated thermal protection system, ITPS)需要同时满足承载与隔热的需求. 以波纹夹芯方案的ITPS为例,这需要其连接结构具有较高的力学性能与较低的热导率. 而再入环境的工况恶劣,如何合理地设计连接结构是ITPS性能提升的关键. 为解决这一问题,综合考虑了再入过程中气动热载荷最大时刻和气动压力载荷最大时刻对应的两种极端工况,以应变能和净传热速率的最小化作为目标函数,将质量作为约束条件,对ITPS的连接结构进行了拓扑优化. 随后对拓扑优化得到的构型重新建模并进行了热力耦合分析. 结果表明,拓扑优化得到的连接结构与文献中的初始波纹夹芯构型和单一工况下拓扑优化得到的构型相比,上面板的最大位移、下面板的温度和质量均有效降低. 由于材料用量的减少和结构复杂度的增加,连接结构在应力水平上有所增加,但仍满足使用需求. 这表明了考虑多再入工况的拓扑优化策略可以有效提升ITPS的刚度与隔热能力,缓解结构的热短路效应. 随着增材制造等相关技术的发展,拓扑优化在ITPS的连接结构以及其他的热结构设计中具有广阔的前景.
    (Contributed by TANG Guangwu, M. AMM Editorial Board)
    1)  (我刊编委唐光武来稿)
  • 图  1  典型的ITPS结构

    Figure  1.  A typical ITPS structure

    图  2  ITPS的几何模型

    Figure  2.  Geometric characteristics of the ITPS

    图  3  典型的再入环境载荷

    Figure  3.  Typical aerodynamic loads during the re-entry flight

    图  4  ITPS的设计域和边界条件

    Figure  4.  The design domain and boundary conditions of the ITPS

    图  5  不同权重组合下的拓扑优化构型

    Figure  5.  Topology optimized configurations under different weight combinations

    图  6  模型重建后的构型特征

    Figure  6.  Configurational characteristics after model reconstruction

    图  7  文献[8]中的拓扑优化构型特征

    Figure  7.  Topology optimized configuration characteristics in ref. [8]

    图  8  拓扑优化构型与参考构型的热力响应对比

    Figure  8.  Comparison of thermal and mechanical responses between topology optimized configurations with reference configurations

    图  9  ITPS连接结构温度响应

    Figure  9.  Temperature response of the connection structure of the ITPS

    表  1  ITPS的尺寸参数

    Table  1.   Sizes of the referenced ITPS design

    parameter value parameter value
    tT/mm 2.1 h/mm 120.0
    tW/mm 3.1 L/mm 117.0
    tB/mm 5.3 θ/(°) 71.0
    下载: 导出CSV

    表  2  材料性能参数

    Table  2.   Material properties

    material Inconel 718 TC4 Al 2024 Saffil
    density ρ/(kg/m3) 8 100 4 440 2 770 50
    elastic modulus E/GPa 199(393 K)
    153(1 033 K)
    115 71 -
    Poisson’s ratio μ 0.294 0.3 0.33 -
    thermal expansion coefficient α/K-1 1.26×10-5(373 K)
    1.61×10-5(1 033 K)
    9.6×10-6 2.0×10-5 -
    thermal conductivity k/(W/(m·K)) 11.1(293 K)
    28(1 273 K)
    7.6 816(255 K)
    975(477 K)
    0.014(477 K)
    0.154(1 144 K)
    specific heat c/(J/kg) 432(293 K)
    620(1 070 K)
    560 944 942(389 K)
    1 339(1 170 K)
    下载: 导出CSV

    表  3  优化构型与参考构型的结构响应对比

    Table  3.   Comparison of structural responses between optimized configurations with reference configurations

    ref #1 ref #2 opt #1 opt #2
    DT, max/mm 5.16 2.97 1.90 1.87
    TB, max/K 393.20 346.38 333.57 328.33
    ST, max/MPa 579.61 289.36 327.80 312.99
    SW, max/MPa 291.90 353.02 384.11 383.51
    SB, max/MPa 199.30 52.43 99.67 88.38
    Vf 0.045 2 0.045 1 0.032 0 0.029 0
    下载: 导出CSV
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  • 收稿日期:  2023-05-29
  • 修回日期:  2023-06-21
  • 刊出日期:  2023-11-01

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