SHI Fei, CHENG Xiao-min, ZHANG Tao-jie, DONG Xiang-huai. Numerical research of temperature field during resin transfer molding[J]. Applied Mathematics and Mechanics, 2016, 37(3): 256-265. doi: 10.3879/j.issn.1000-0887.2016.03.004
Citation: SHI Fei, CHENG Xiao-min, ZHANG Tao-jie, DONG Xiang-huai. Numerical research of temperature field during resin transfer molding[J]. Applied Mathematics and Mechanics, 2016, 37(3): 256-265. doi: 10.3879/j.issn.1000-0887.2016.03.004

Numerical research of temperature field during resin transfer molding

doi: 10.3879/j.issn.1000-0887.2016.03.004
Funds:  The National Natural Science Foundation of China(General Program)(51275251)
  • Received Date: 2015-11-02
  • Rev Recd Date: 2015-12-29
  • Publish Date: 2016-03-15
  • The temperature field is the most important concern during resin transfer molding of resin-based composite materials. The temperature field deciding the molding process and product quality was investigated through numerical simulation. Some factors influencing the temperature field, such as porosity of the porous media, resin reaction heat, resin injection temperature and resin injection flux, were discussed. In the simulation the 3D 1st-order upwind scheme was applied for spatial discretization, and the implicit scheme was used for time integration. Comparison between the present results and those previous ones proves the correctness and effectiveness of the proposed numerical method. It is also shown that, the resin injection temperature influences the temperature field much more markedly than the other factors, and the factors’ effects on the part near the resin inlet are much weaker than those on the parts far away from the inlet, which means more temperature measure points shall be arranged in the zones far away from the inlet to better detect the real temperature field.
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